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Autor: Lieng-Huang Lee
ISBN-13: 9780306418884
Einband: Buch
Seiten: 871
Gewicht: 1621 g
Sprache: Englisch
Erscheinungsdatum: 31.03.1985

Adhesive Chemistry

.29, Polymer Science and Technology Series
Developments and Trends
Proceedings of a Symposium on Recent Developments in Adhesive Chemistry, sponsored by the Divsion of Organic Coatings and Plastics Chemistry of the American Chemical Society, held March 21-23, 1983, in Seattle, Washington
One: Chemistry of Adhesion - The Importance of Interface.- Introductory Remarks.- Recent Developments in Adhesive and Sealant Chemistry.- Overview of Adherence Phenomena.- An Analytical Method for Determining the Surface Energy of Solid Polymers.- Effect of Amine Surface Treatment on the Adhesion of Polyurethane to the Surface.- Effect of Silane on Glass/Resin Adhesion Strength.- Discussion.- Two: Physics of Adhesion - Characterization of Surface and Bulk of Adhesive Systems.- Introductory Remarks.- New Applications of ESCA.- Fracto-Emission Accompanying Adhesive Failure.- Monitoring Epoxy Cure Kinetics with a Viscosity-Dependent Fluorescent Probe.- Dynamic Mechanical Properties of Silicone Pressure Sensitive Adhesives.- The Viscoelastic Properties of Pressure-Sensitive Adhesives.- Block Copolymer Adhesive Studies.- Discussion.- Three: Radiation-Curable Adhesives.- Introductory Remarks.- Ultraviolet Cured Pressure-Sensitive Adhesives.- Recent Progress in Photoinitiated Cationic Polymerization.- Polymer and Formulation Design Characteristics for Developing Bonding Capabilities of Radiation-Curable Coatings and Adhesive Systems.- Dynamic Thermal Analysis Characterizations of Electron-Beam Cured Adhesives.- Reactive Butadiene/Acrylonitrile Liquid and Solid Elastomers: Formulating Acrylic, Anaerobic, and Radiation-Curable Adhesives.- Photoinitiators: A Review of Mechanisms and Applications.- Discussion.- Four: High Temperature Adhesives.- Introductory Remarks.- Status of High Temperature Adhesives.- Polyimide Adhesives: Modified with ATBN and Silicone Elastomers.- The Application of Thermodynamic and Spectroscopic Techniques to Adhesion in the Polyimide/Ti 6-4 and Polyphenyl-quinoxaline/Ti 6-4 Systems.- Evaluation of High Temperature Structural Adhesives for Extended Service.- Aminosilane and Metal Modifications of Polyimide Surfaces.- Influence of Molecular Weight on Fracture Behavior of Polyphenylquinoxaline Thermosets.- Discussion.- Five: Anaerobic and Structural Adhesives.- Introductory Remarks.- Some Recent Developments in Scanning Electron Microscopy.- Potential Anaerobic and Structural Acrylic Modified Polyester Adhesives.- Anaerobic Adhesives Containing Maleimides Having Improved Thermal Resistance.- Chemistry of Accelerators for Curing Anaerobic Adhesives - Reaction of N,N-Dimethylaniline Derivatives with Cumene Hydroperoxide.- Chemistry, Physical Properties and Durability of Structural Adhesive Bonds.- Reactive Butadiene/Acrylonitrile Liquid and Solid Elastomers: A Bibliography for Formulating Epoxy Structured Adhesives.- A Low Curing Temperature CTBN-Toughened Epoxy Adhesive.- Summarizing Remarks.- Discussion.- Six: Trends in Adhesive Research.- Developments in and Limitations of Adhesive Materials for Severe Environments and a Long Service Life.- Elastomers and Resin Modifiers for Water-Base Adhesives.- "Aerobic" Acrylic Adhesives- New Technology in Acrylic Adhesives.- Radiant Energy Curable Adhesives.- Isocyanatoethyl Methacrylate: A Latent Cross linker for Coating Adhesive Resins.- Moisture Permeation of Polymer Sealants and Interface Modifying Films.- ESCA and AES Studies of the Interfacial Chemical Bonding between Aluminum and Chromium (III) Fumarato-Coordination Compound.- Adhesive Research in China.- Discussion.- Contributors.- Author Index.
Since the first symposium on Recent Advances in Adhesion, held September, 1971 in Washington, D. C. , this Division of the American Chemical Society has continuously sponsored several symposia on adhesion and adhesives. The chemists have gradually realized the importance of adhesion in various fields of science and technology. During these years, the science of adhesion has steadily grown along with progress in surface science and fracture mechanics. Moreover, new adhesives have been invented and applied in actual structures, for example, structural and aerospace adhesives. In response to socio-economic demands, new forms of adhesives have been introduced to combat the problems of pollution and to promote energy-conservation. The developments of hot-melt adhesives, waterborne adhesives, and radiation-curable adhesives are vivid examples of successes in solving some of the problems. As chemists, our hatural desire is to understand how those new adhesives and new forms of adhesives are made. Thus, we are interested in learning about the chemistry of adhesives so that we may create new generations of materials to satisfy future needs. It was based on this common interest that w~ set forth to org'anize this Symposium on Recent Developments in Adhesive Chemistry. It was held from March 21 through 23, 1983 in the Westin Hotel, Seattle, Washington. The Symposium was very well attended. As a matter of fact, for the first two sessions, we had to move from the smaller Mt. St.
Autor: Lieng-Huang Lee
ISBN-13:: 9780306418884
ISBN: 0306418886
Erscheinungsjahr: 31.03.1985
Verlag: Springer, Berlin
Gewicht: 1621g
Seiten: 871
Sprache: Englisch
Auflage 1984
Sonstiges: Buch